An air temperature and humidity control device is provided including a first heat pump having a compressor, an expansion valve, a condenser, and an evaporator. The first heat pump has a refrigerant circulating there through. A humidity controller includes a first contactor fluidly coupled to the evaporator and condenser. The first contact includes at least one contact module having a porous sidewall that defines an internal space through which a hygroscopic material flows. A first air flow is in communication with the porous sidewall of the first contactor. The device also has a second heat pump including a first polishing coil. The first polishing coil is substantially aligned with and arranged generally downstream from the first contactor relative to the first air flow.