Invention Grant
US09263496B2 Method of manufacturing an image sensor by joining a pixel circuit substrate and a logic circuit substrate and thereafter thinning the pixel circuit substrate
有权
通过连接像素电路基板和逻辑电路基板，然后使像素电路基板变薄来制造图像传感器的方法
- Patent Title: Method of manufacturing an image sensor by joining a pixel circuit substrate and a logic circuit substrate and thereafter thinning the pixel circuit substrate
- Patent Title (中): 通过连接像素电路基板和逻辑电路基板，然后使像素电路基板变薄来制造图像传感器的方法
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Application No.: US14371550Application Date: 2013-01-08
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Publication No.: US09263496B2Publication Date: 2016-02-16
- Inventor: Nobutoshi Fujii , Kenichi Aoyagi , Yoshiya Hagimoto , Hayato Iwamoto
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Dentons US LLP
- Priority: JP2012-007086 20120117; JP2012-007087 20120117; JP2012-007088 20120117
- International Application: PCT/JP2013/050093 WO 20130108
- International Announcement: WO2013/108657 WO 20130725
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L27/146 ; H01L25/00 ; H01L31/18 ; H01L25/065
Abstract:
The present technology includes: bonding a device formation side of a first substrate having a first device and a device formation side of a second substrate having a second device in opposition to each other; forming a protective film on at least an edge of the second substrate having the second device; and reducing a thickness of the first substrate.
Public/Granted literature
- US20150004738A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2015-01-01
Information query
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