Invention Grant
- Patent Title: Housing cap for an electronics housing, respectively electronics housing fromed therewith
- Patent Title (中): 电子设备外壳的盖帽,分别为电子设备外壳
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Application No.: US14364134Application Date: 2012-11-22
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Publication No.: US09261385B2Publication Date: 2016-02-16
- Inventor: Philipp Loeffel , Utz Dette , Sascha Kamber
- Applicant: Endress + Hauser Flowtec AG
- Applicant Address: CH Reinach
- Assignee: ENDRESS + HAUSER FLOWTEC AG
- Current Assignee: ENDRESS + HAUSER FLOWTEC AG
- Current Assignee Address: CH Reinach
- Agency: Bacon & Thomas, PLLC
- Priority: DE102011088495 20111214
- International Application: PCT/EP2012/073326 WO 20121122
- International Announcement: WO2013/087390 WO 20130620
- Main IPC: H05K5/00
- IPC: H05K5/00 ; G01D11/24 ; G01D11/26 ; H05K7/14 ; G01D5/00

Abstract:
A housing cap comprises: a cap basic body having a cap floor having an opening as well as a surrounding cap lateral wall adjoining an edge of the cap floor. A window pane of a transparent material placed on a side of the cap floor facing toward the cap lateral wall in a manner sealing the opening of the cap floor; as well as a contact disk placed on a side of the window pane facing away from the cap floor. The cap lateral wall includes on an inner side facing the window pane a groove, while the contact disk has a contact region bearing against the window pane as well as an outer edge having formed therein a plurality of teeth, which are in engagement with the groove.
Public/Granted literature
- US20150028730A1 HOUSING CAP FOR AN ELECTRONICS HOUSING, RESPECTIVELY ELECTRONICS HOUSING FROMED THEREWITH Public/Granted day:2015-01-29
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