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US09240538B2 LED spirit system and manufacturing method 有权
LED精神系统及制造方法

LED spirit system and manufacturing method
摘要:
The present invention relates to a new method, system and apparatus for light emitting diode (LED) packages. An object of the present invention is to provide an LED package having reduced components, a superior heat dissipation property and a compact structure, does not largely restrict use of conventional equipment for its manufacture, and is compatible with implementation within present illumination devices packaging.
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