发明授权
- 专利标题： Semiconductor package with cantilever leads
- 专利标题（中）： 半导体封装采用悬臂引线
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申请号： US14251849申请日： 2014-04-14
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公开(公告)号： US09240367B2公开(公告)日： 2016-01-19
- 发明人: Jeffrey Gail Holloway
- 申请人： Texas Instruments Incorporated
- 申请人地址： US TX Dallas
- 专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人地址： US TX Dallas
- 代理商 Steven A. Shaw; Frank D. Cimino
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/56 ; H01L23/31 ; H01L23/00
摘要：
A semiconductor package includes a metallic leadframe having a plurality of cantilever leads, a mounting area for mounting a die, and one or more non-conductive supports adjacent to a recessed surface of the cantilever leads to support the leads during die mount, wire bond, and encapsulation processes. Encapsulant encapsulates and supports at least a portion of the die, the leadframe.
公开/授权文献
- US20140217568A1 Semiconductor Package with Cantilever Leads 公开/授权日：2014-08-07
信息查询
IPC分类:
