Invention Grant
- Patent Title: Semiconductor device, semiconductor package, and electronic system
- Patent Title (中): 半导体器件,半导体封装和电子系统
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Application No.: US14168317Application Date: 2014-01-30
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Publication No.: US09240366B2Publication Date: 2016-01-19
- Inventor: Jeong-Gi Jin , Ho-Joon Lee , Ji-Woong Sue , Joo-Hee Jang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: EIPG, PLLC
- Priority: KR10-2013-0044439 20130422
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/48 ; H01L23/367 ; H01L25/065 ; H01L23/31 ; H01L23/522

Abstract:
Provided are a semiconductor device, a semiconductor package, and an electronic system. The device includes a substrate having a front side and a back side disposed opposite the front side. An internal circuit is disposed on or near to the front side of the substrate. Signal I/O through-via structures are disposed in the substrate. Back side conductive patterns are disposed on the back side of the substrate and electrically connected to the signal I/O through-via structures. A back side conductive structure is disposed on the back side of the substrate and spaced apart from the signal I/O through-via structures. The back side conductive structure includes parallel supporter portions.
Public/Granted literature
- US20140312491A1 SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND ELECTRONIC SYSTEM Public/Granted day:2014-10-23
Information query
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