Invention Grant
US09240366B2 Semiconductor device, semiconductor package, and electronic system 有权
半导体器件,半导体封装和电子系统

Semiconductor device, semiconductor package, and electronic system
Abstract:
Provided are a semiconductor device, a semiconductor package, and an electronic system. The device includes a substrate having a front side and a back side disposed opposite the front side. An internal circuit is disposed on or near to the front side of the substrate. Signal I/O through-via structures are disposed in the substrate. Back side conductive patterns are disposed on the back side of the substrate and electrically connected to the signal I/O through-via structures. A back side conductive structure is disposed on the back side of the substrate and spaced apart from the signal I/O through-via structures. The back side conductive structure includes parallel supporter portions.
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