Invention Grant
- Patent Title: Heat pump apparatus with ejector cycle
- Patent Title (中): 带喷射器循环的热泵设备
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Application No.: US13499365Application Date: 2009-10-20
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Publication No.: US09200820B2Publication Date: 2015-12-01
- Inventor: Takashi Okazaki , So Nomoto , Shinya Higashiiue , Hirokazu Minamisako
- Applicant: Takashi Okazaki , So Nomoto , Shinya Higashiiue , Hirokazu Minamisako
- Applicant Address: JP Chiyoda-Ku, Tokyo
- Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee Address: JP Chiyoda-Ku, Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- International Application: PCT/JP2009/068040 WO 20091020
- International Announcement: WO2011/048662 WO 20110428
- Main IPC: F25B41/04
- IPC: F25B41/04 ; F25B13/00 ; F25B41/00

Abstract:
In a heat pump apparatus, switching between high efficiency operation, and high capacity operation, is performed according to the state of the load. A main refrigerant circuit uses an ejector. A first sub-refrigerant circuit connects a portion between a heat exchanger and an ejector to a portion between a gas-liquid separator and a heat exchanger A second sub-refrigerant circuit connects a portion between the heat exchanger and the ejector to an injection pipe of a compressor. When the load is medium, refrigerant is circulated in the main refrigerant circuit to perform an efficient ejector aided operation. When the load is large, a high capacity injection operation is performed by flowing refrigerant to the second sub-refrigerant circuit. When the load is small, a simple bypass operation prevents degradation of efficiency by flowing refrigerant to the first sub-refrigerant circuit.
Public/Granted literature
- US20120180510A1 HEAT PUMP APPARATUS Public/Granted day:2012-07-19
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