Invention Grant
US09171941B2 Fabricating method of thin film transistor, fabricating method of array substrate and display device
有权
薄膜晶体管的制造方法,阵列基板和显示装置的制造方法
- Patent Title: Fabricating method of thin film transistor, fabricating method of array substrate and display device
- Patent Title (中): 薄膜晶体管的制造方法,阵列基板和显示装置的制造方法
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Application No.: US14028667Application Date: 2013-09-17
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Publication No.: US09171941B2Publication Date: 2015-10-27
- Inventor: Seongyeol Yoo , Yoonsung Um
- Applicant: BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE Technology Group Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- Priority: CN201210345262 20120917
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L29/66 ; H01L29/786 ; H01L27/12

Abstract:
An embodiment of the present invention provides a fabricating method of a thin film transistor, a fabricating method of an array substrate, and a display device. The fabricating method of a thin film transistor comprises: forming a gate electrode on a substrate; and forming a gate insulating layer, a semiconductor layer, source and drain electrodes and a channel region on the substrate, wherein, the semiconductor layer is formed of a metal oxide, and two etching steps are used to form the channel region, and in a first etching step, a part of a source-drain metal layer above the semiconductor layer corresponding to the channel region is removed by using a dry etching, and in a second etching step, a remaining part of the source-drain metal layer above the semiconductor layer corresponding to the channel region is removed by using a wet etching, thereby forming the channel region.
Public/Granted literature
- US20140080254A1 Fabricating Method Of Thin Film Transistor, Fabricating Method Of Array Substrate And Display Device Public/Granted day:2014-03-20
Information query
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