发明授权
- 专利标题： Semiconductor package with small gate clip and assembly method
- 专利标题（中）： 半导体封装采用小门夹和组装方式
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申请号： US14502902申请日： 2014-09-30
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公开(公告)号： US09171788B1公开(公告)日： 2015-10-27
- 发明人: Yan Xun Xue , Hamza Yilmaz , Yueh-Se Ho , Jun Lu , Ming-Chen Lu , Hongtao Gao
- 申请人： Alpha and Omega Semiconductor Incorporated
- 申请人地址： US CA Sunnyvale
- 专利权人： Alpha and Omega Semiconductor Incorporated
- 当前专利权人： Alpha and Omega Semiconductor Incorporated
- 当前专利权人地址： US CA Sunnyvale
- 代理商 Chein-Hwa S. Tsao; Chen-Chi Lin
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
A method of manufacturing a semiconductor package having a small gate clip is disclosed. A first and second semiconductor chips, each of which includes a source electrode and a gate electrode at a top surface, are attached on two adjacent lead frame units of a lead frame such that the lead frame unit with the first chip formed thereon is rotated 180 degrees in relation to the other lead frame unit with the second semiconductor chip formed thereon. A first and second clip sets are mounted on the first and second semiconductor chips, wherein the first clip set is connected to the gate electrode of the first chip, the source electrode of the second chip, and their corresponding leads and the second clip set is connected to the gate electrode of the second chip, the source electrode of the first chip and their corresponding leads.
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