发明授权
- 专利标题: Patterned metal layer to control solder connection between laser and submount in a magnetic head
- 专利标题(中): 图案化金属层,用于控制激光与磁头之间的焊接连接
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申请号: US14663031申请日: 2015-03-19
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公开(公告)号: US09171562B1公开(公告)日: 2015-10-27
- 发明人: Wachira Puttichaem , Bin Ouyang
- 申请人: Western Digital (Fremont), LLC
- 申请人地址: US CA Fremont
- 专利权人: Western Digital (Fremont), LLC
- 当前专利权人: Western Digital (Fremont), LLC
- 当前专利权人地址: US CA Fremont
- 主分类号: G11B11/00
- IPC分类号: G11B11/00 ; G11B13/08 ; G11B5/48 ; G11B5/60 ; G11B7/12 ; G11B5/00
摘要:
A laser diode device is affixed to a mounting face of a slider, opposite the air bearing surface. The laser includes a submount having an electrically conductive surface layer that is normal to the mounting face. The electrically conductive surface layer is a patterned metal layer that includes a lateral probing region and a laser mounting region to which a laser is soldered. The laser mounting region is connected to the lateral probing region by a bridge portion of the patterned metal layer. The laser mounting region is otherwise separated from the lateral probing region by a solder blocking gap in which the submount lacks the patterned metal layer, and which is adjacent to the laser. The solder blocking gap defines a solder blocking gap height normal to the mounting face that is in the range of ⅔rds to ⅚ths of a total height of the laser mounting region.
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