Invention Grant
- Patent Title: Floor panel
- Patent Title (中): 地板面板
-
Application No.: US14632088Application Date: 2015-02-26
-
Publication No.: US09163414B2Publication Date: 2015-10-20
- Inventor: Laurent Meersseman , Martin Segaert , Bernard Thiers , Benjamin Clement , Christophe Maesen
- Applicant: Laurent Meersseman , Martin Segaert , Bernard Thiers , Benjamin Clement , Christophe Maesen
- Applicant Address: LU Bertange
- Assignee: Flooring Industries Limited, SARL
- Current Assignee: Flooring Industries Limited, SARL
- Current Assignee Address: LU Bertange
- Agency: Capitol City TechLaw
- Priority: BE2010/0283 20100510
- Main IPC: E04B2/00
- IPC: E04B2/00 ; E04F15/10 ; E04F15/02 ; B32B7/12 ; B32B21/02
Abstract:
In a method for manufacturing floor panels that have at least a substrate and a top layer provided on the substrate, the top layer including a thermoplastic layer that is translucent or transparent, the method may involve providing the top layer, including the thermoplastic layer, on the substrate. The method may also involve heating at least the thermoplastic layer, and structuring the thermoplastic layer using a mechanical press element.
Public/Granted literature
- US20150167320A1 FLOOR PANEL Public/Granted day:2015-06-18
Information query
