发明授权
- 专利标题: Light emitting device-light receiving device assembly, and manufacturing method thereof
- 专利标题(中): 发光装置 - 光接收装置组件及其制造方法
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申请号: US13410441申请日: 2012-03-02
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公开(公告)号: US09159712B2公开(公告)日: 2015-10-13
- 发明人: Hiizu Ootorii
- 申请人: Hiizu Ootorii
- 申请人地址: JP Tokyo
- 专利权人: SONY CORPORATION
- 当前专利权人: SONY CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: Dentons US LLP
- 优先权: JP2011-072401 20110329
- 主分类号: H01S5/026
- IPC分类号: H01S5/026 ; H01L25/16 ; H01L23/00
摘要:
A light emitting device-light receiving device assembly includes: a mount substrate having first and second surfaces, and including a first base as a raised portion on the first surface; a light receiving device having first and second surfaces, the first surface of the light receiving device being anchored on the first base; and a light emitting device, the light receiving device including a light passage portion allowing for passage of light emitted by the light emitting device, the light emitted by the light emitting device emerging to outside through the light passage portion, the first base, and the mount substrate, the light receiving device receiving externally incident light through the mount substrate and the first base, the light receiving device including an annular second base as a raised portion on the second surface of the light receiving device, and the light emitting device being anchored on the second base.
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