发明授权
- 专利标题: Method of separating workpieces from chips
- 专利标题(中): 从芯片上分离工件的方法
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申请号: US14583917申请日: 2014-12-29
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公开(公告)号: US09156036B2公开(公告)日: 2015-10-13
- 发明人: Shozen Yanakawa , Hiroshi Kasuya , Kyota Kotake , Satoru Akimoto , Takahiro Mogi , Youji Takeuchi , Umeo Tsuyusaki
- 申请人: Shozen Yanakawa , Hiroshi Kasuya , Kyota Kotake , Satoru Akimoto , Takahiro Mogi , Youji Takeuchi , Umeo Tsuyusaki
- 申请人地址: JP Tokyo JP Nagano
- 专利权人: Citizen Holdings Co. Ltd.,Citizen Machinery Co., Ltd.
- 当前专利权人: Citizen Holdings Co. Ltd.,Citizen Machinery Co., Ltd.
- 当前专利权人地址: JP Tokyo JP Nagano
- 代理机构: Howson & Howson LLP
- 优先权: JP2010-278108 20101214
- 主分类号: B03B5/62
- IPC分类号: B03B5/62 ; B08B3/04 ; B23Q7/12 ; B03B5/00 ; B23Q11/00
摘要:
There is provided a workpiece separation apparatus permitting input of a mixture of workpieces and chips stably within a flow current and separating them accurately and efficiently. The workpiece separation apparatus includes an input cylinder inserted within a separating container, and a fluid supplying means arranged so as to supply fluid to the separating container from a part lower than a lower end of the input cylinder, and configured such that the fluid overflows and flows out of the upper end of the separating container due to a flow current generated within the separating container, and such that the level of the fluid rises up in the input cylinder and the fluid does not flow out of the upper end of the input cylinder, but is maintained substantially in a resting state and at a level above the level of the upper end of the separating container.
公开/授权文献
- US20150114889A1 METHOD OF SEPARATING WORKPIECES FROM CHIPS 公开/授权日:2015-04-30
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