Invention Grant
- Patent Title: Heat dissipating apparatus for folding electronic devices
- Patent Title (中): 用于折叠电子设备的散热装置
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Application No.: US13706492Application Date: 2012-12-06
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Publication No.: US09148979B2Publication Date: 2015-09-29
- Inventor: Victor A. Chiriac , Dexter T. Chun
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Michelle S. Gallardo
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20 ; H05K13/04 ; H01L23/473

Abstract:
Some implementations provide a folding electronic device that includes a base portion, a cover portion and a coupler. The base portion includes a region configured to generate heat. The cover portion includes a display screen, a heat dissipating component, and a thermally insulating component. The heat dissipating component is coplanar to the display screen. The thermally insulating component is coplanar to the display screen. The thermally insulating component is located between the display screen and the heat dissipating component. The coupler is for thermally coupling the base portion to the cover portion. The coupler includes a first component and a second component. The first component is coupled to the region configured to generate heat. The second component is coupled to the heat dissipating component of the cover portion. The coupler provides a path for transferring heat.
Public/Granted literature
- US20140098489A1 HEAT DISSIPATING APPARATUS FOR FOLDING ELECTRONIC DEVICES Public/Granted day:2014-04-10
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