Invention Grant
- Patent Title: Electrical contact and electrical connector used thereof
- Patent Title (中): 电触点和电连接器
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Application No.: US14028562Application Date: 2013-09-17
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Publication No.: US09142915B2Publication Date: 2015-09-22
- Inventor: Yen-Chih Chang , Wei-Hung Hsu
- Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
- Applicant Address: TW New Taipei
- Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: TW New Taipei
- Agent Wei Te Chung; Ming Chieh Chang
- Priority: TW101217891U 20120917
- Main IPC: H01R13/627
- IPC: H01R13/627 ; H01R13/24 ; H01R13/41 ; H05K7/10
Abstract:
An electrical contact (2) for electrically connecting an IC package having solder balls (4) with a substrate and includes a base portion (21), a spring arm (24) extending upwardly from the base portion (21) and a rear portion (23) extending downwardly from the base portion (21), the spring arm (24) defines a contact portion (25) at the end thereof to connect with the solder ball (4) of the IC package, the contact portion (25) includes a wide portion (252) with a width larger than other portions of the contact portion (25), the wide portion (252) includes a pair of higher end portions (2520) at opposite ends thereof and a lower middle portion (2521) between the pair of end portions (2520).
Public/Granted literature
- US20140080330A1 ELECTRICAL CONTACT AND ELECTRICAL CONNECTOR USED THEREOF Public/Granted day:2014-03-20
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