发明授权
- 专利标题： Moisture barrier for a wire bond
- 专利标题（中）： 导线键合的水分屏障
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申请号： US14283602申请日： 2014-05-21
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公开(公告)号： US09136245B2公开(公告)日： 2015-09-15
- 发明人: John M. DeLucca , Ronald J. Weachock , Barry J. Dutt , Frank A. Baiocchi , John W. Osenbach
- 申请人： LSI Corporation
- 申请人地址： SG Singapore
- 专利权人： Avago Technologies General IP (Singapore) Pte. Ltd
- 当前专利权人： Avago Technologies General IP (Singapore) Pte. Ltd
- 当前专利权人地址： SG Singapore
- 主分类号： H01L23/485
- IPC分类号： H01L23/485 ; H01L23/00 ; H01L23/31
摘要：
An electronic device comprising a bond pad on a substrate and a wire bonded to the bond pad. The device further comprises an intermetallic compound interface located between the bond pad and the wire and a silicon nitride or silicon carbonyl layer covering the intermetallic compound interface.
公开/授权文献
- US20140349475A1 MOISTURE BARRIER FOR A WIRE BOND 公开/授权日：2014-11-27
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