发明授权
US09135936B1 Microactuated suspension with spring bias acting on conductive adhesive bond for improved reliability
有权
具有弹簧偏压的微致动悬挂作用在导电胶粘剂上,以提高可靠性
- 专利标题: Microactuated suspension with spring bias acting on conductive adhesive bond for improved reliability
- 专利标题(中): 具有弹簧偏压的微致动悬挂作用在导电胶粘剂上,以提高可靠性
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申请号: US14664846申请日: 2015-03-21
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公开(公告)号: US09135936B1公开(公告)日: 2015-09-15
- 发明人: Peter Hahn , Steve Misuta , Long Zhang , Kuen Chee Ee
- 申请人: Magnecomp Corporation
- 申请人地址: US CA Murrieta
- 专利权人: MAGNECOMP CORPORATION
- 当前专利权人: MAGNECOMP CORPORATION
- 当前专利权人地址: US CA Murrieta
- 代理机构: Intellectual Property Law Offices of Joel Voelzke, APC
- 主分类号: G11B5/48
- IPC分类号: G11B5/48
摘要:
In an electrical connection to a microactuator in a disk drive suspension, an electrical lead is adhered to a microactuator using conductive adhesive and is also mechanically pressed up against the microactuator using a bias mechanism. The bias mechanism may be a spring finger that is welded to the suspension, or it may be a stainless steel finger that is formed integrally with the trace gimbal assembly. The resulting bias force that presses the contact against the microactuator surface reduces the small failure rate that can occur when the conductive adhesive separates from the microactuator's surface as a result of stress such as induced by thermal cycling.
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