Invention Grant
- Patent Title: Managing throughput for multiple processes in a materials handling facility
- Patent Title (中): 管理材料处理设施中多个流程的吞吐量
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Application No.: US12788117Application Date: 2010-05-26
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Publication No.: US09129247B2Publication Date: 2015-09-08
- Inventor: Yusuke Hara , Joseph M. Alyea , Cherie G. Wong
- Applicant: Yusuke Hara , Joseph M. Alyea , Cherie G. Wong
- Applicant Address: US NV Reno
- Assignee: Amazon Technologies, Inc.
- Current Assignee: Amazon Technologies, Inc.
- Current Assignee Address: US NV Reno
- Agency: Meyertons, Hood, Kivlin, Kowert & Goetzel, P.C.
- Agent Robert C. Kowert
- Main IPC: G06Q10/00
- IPC: G06Q10/00 ; G06Q10/08 ; G06Q10/06

Abstract:
Various embodiments of a system and method for process management in a materials handling facility are described. Embodiments may include a process control component configured to generate a model of multiple unit handling processes of a materials handling facility. For each process, the model may indicate a measured throughput rate. The process control component may be configured to, based on at least one target output rate that is a goal for the output rate of a given unit handling process, evaluate the model to generate a particular target throughput rate that is a goal for the respective throughput rate of a particular unit handling process that is performed prior to the given unit handling process. The process control component may be configured to, based on the particular target throughput rate, generate one or more instructions to control the respective throughput rate of units processed by the particular unit handling process.
Public/Granted literature
- US20110295644A1 System And Method For Process Management In A Materials Handling Facility Public/Granted day:2011-12-01
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