Invention Grant
- Patent Title: Elastic wave device
- Patent Title (中): 弹性波装置
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Application No.: US13521239Application Date: 2011-12-14
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Publication No.: US09124239B2Publication Date: 2015-09-01
- Inventor: Hideaki Nakayama , Atsushi Takano , Mitsuhiro Furukawa
- Applicant: Hideaki Nakayama , Atsushi Takano , Mitsuhiro Furukawa
- Applicant Address: JP Kadoma-Shi
- Assignee: SKYWORKS PANASONIC FILTER SOLUTIONS JAPAN CO., LTD.
- Current Assignee: SKYWORKS PANASONIC FILTER SOLUTIONS JAPAN CO., LTD.
- Current Assignee Address: JP Kadoma-Shi
- Agency: Lando & Anastasi, LLP
- Priority: JP2010-280146 20101216; JP2011-051194 20110309
- International Application: PCT/JP2011/006977 WO 20111214
- International Announcement: WO2012/081240 WO 20120621
- Main IPC: H03H9/72
- IPC: H03H9/72 ; H03H9/25 ; H03H9/05 ; H03H9/10 ; H03H9/00 ; H03H9/145

Abstract:
An elastic wave device includes a piezoelectric substrate, an IDT electrode disposed on the piezoelectric substrate, a wiring electrode disposed on the piezoelectric substrate and connected to the IDT electrode, a first insulator disposed on the piezoelectric substrate to seal the IDT electrode and the wiring electrode, a resin layer provided on the first insulator, an inductor electrode disposed on the resin layer, a second insulator disposed on the resin layer to cover the inductor electrode, a terminal electrode disposed on the second insulator, and a connecting electrode passing through the first insulator, the second insulator, and the resin layer to electrically connect the wiring electrode, the terminal electrode, and the inductor electrode. The first insulator includes a resin and filler dispersed in the resin. A density of filler in the resin layer is smaller than an average density of the filler in the first insulator. This elastic wave device has excellent characteristics of the inductor while reducing variations of the characteristics.
Public/Granted literature
- US20120280768A1 ELASTIC WAVE DEVICE Public/Granted day:2012-11-08
Information query
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