Invention Grant
- Patent Title: Single-package bridge-type magnetic-field angle sensor
- Patent Title (中): 单封装桥式磁场角传感器
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Application No.: US14002738Application Date: 2012-03-02
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Publication No.: US09123876B2Publication Date: 2015-09-01
- Inventor: James Geza Deak , Weifeng Shen , Xiaojun Zhang , Xiaofeng Lei , Insik Jin , Songsheng Xue
- Applicant: James Geza Deak , Weifeng Shen , Xiaojun Zhang , Xiaofeng Lei , Insik Jin , Songsheng Xue
- Applicant Address: CN
- Assignee: MultiDimension Technology Co., Ltd.
- Current Assignee: MultiDimension Technology Co., Ltd.
- Current Assignee Address: CN
- Agency: Schwegman Lundberg & Woessner, P.A.
- Priority: CN201110050747 20110303
- International Application: PCT/CN2012/071879 WO 20120302
- International Announcement: WO2012/116659 WO 20120907
- Main IPC: H01L27/22
- IPC: H01L27/22 ; H01L43/02 ; G01B7/30 ; G01R33/09 ; H01L43/08 ; G01D5/14
Abstract:
A single-package bridge-type magnetic-field angle sensor comprising one or more pairs of magnetic tunnel junction sensor chips rotated relative to each other by 90 degrees in order to detect two magnetic field components in orthogonal directions respectively is disclosed. The magnetic-field angle sensor may comprise a pair of MTJ full-bridges or half-bridges interconnected with a semiconductor package lead. The magnetic-field angle sensor can be packaged into various low-cost standard semiconductor packages.
Public/Granted literature
- US20130334634A1 Single-Package Bridge-Type Magnetic-Field Angle Sensor Public/Granted day:2013-12-19
Information query
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