Invention Grant
- Patent Title: Seal ring structure for integrated circuit chips
- Patent Title (中): 集成电路芯片的密封环结构
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Application No.: US13004261Application Date: 2011-01-11
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Publication No.: US09117831B2Publication Date: 2015-08-25
- Inventor: Ching-Jung Yang , Yu-Wen Liu , Michael Shou-Ming Tong , Hsien-Wei Chen , Chung-Ying Yang , Tsung-Yuan Yu
- Applicant: Ching-Jung Yang , Yu-Wen Liu , Michael Shou-Ming Tong , Hsien-Wei Chen , Chung-Ying Yang , Tsung-Yuan Yu
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Lowe Hauptman & Ham, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/58
Abstract:
A semiconductor device includes a substrate having a circuit region and a seal ring region. The seal ring region surrounds the circuit region. A seal ring structure is disposed over the seal ring region. The seal ring structure has a first portion and a second portion above the first portion. The first portion has a width W1, and the second portion has a width W2. The width W1 is less than the width W2.
Public/Granted literature
- US20120175728A1 SEAL RING STRUCTURE FOR INTEGRATED CIRCUIT CHIPS Public/Granted day:2012-07-12
Information query
IPC分类:
