发明授权
- 专利标题: EBG structure and circuit board
- 专利标题(中): EBG结构和电路板
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申请号: US13951875申请日: 2013-07-26
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公开(公告)号: US09112475B2公开(公告)日: 2015-08-18
- 发明人: Tadahiro Sasaki , Kazuhiko Itaya , Hiroshi Yamada
- 申请人: Kabushiki Kaisha Toshiba
- 申请人地址: JP Minato-ku
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Minato-ku
- 代理机构: Oblon, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2012-167661 20120727
- 主分类号: H04B3/28
- IPC分类号: H04B3/28 ; H03H7/01 ; H05K1/02
摘要:
An EBG (Electromagnetic Band Gap) structure according to an embodiment includes: an electrode that is made of a first conductor; a first insulating layer that is provided on the electrode; a patch unit that is provided in substantially parallel with the electrode on the first insulating layer, the patch unit including a first gap, the patch unit being made of a second conductor; a second insulating layer that is provided on the patch unit; a first via that is provided between the patch unit in the first insulating layer and the electrode and connected to the patch unit and the electrode; and a second via that is provided in the first and second insulating layers, the second via piercing the first gap and being connected to the electrode.
公开/授权文献
- US20140028412A1 EBG STRUCTURE AND CIRCUIT BOARD 公开/授权日:2014-01-30
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