Invention Grant
- Patent Title: Mechanism for forming MEMS device
- Patent Title (中): MEMS器件的形成机理
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Application No.: US14098974Application Date: 2013-12-06
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Publication No.: US09090452B2Publication Date: 2015-07-28
- Inventor: Shyh-Wei Cheng , Jui-Chun Weng , Hsi-Cheng Hsu , Chih-Yu Wang , Chuan-Yi Ko , Ji-Hong Chiang , Chung-Hsien Hung , Hsin-Yu Chen , Chih-Hsien Chen , Yu-Mei Wu , Jong Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/84
- IPC: H01L29/84 ; B81B3/00 ; B81C1/00
Abstract:
Embodiments of mechanisms for forming a micro-electro mechanical system (MEMS) device are provided. The MEMS device includes a substrate and a MEMS substrate disposed on the substrate. The MEMS substrate includes a movable element, a fixed element and at least a spring connected to the movable element and the fixed element. The MEMS device also includes a polysilicon layer on the movable element.
Public/Granted literature
- US20150158716A1 MECHANISM FOR FORMING MEMS DEVICE Public/Granted day:2015-06-11
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