Invention Grant
US09086526B2 Photocurable adhesive composition, module apparatus using the same, and method of assembling a module
有权
光固化性粘合剂组合物，使用其的模块装置以及组装模块的方法
- Patent Title: Photocurable adhesive composition, module apparatus using the same, and method of assembling a module
- Patent Title (中): 光固化性粘合剂组合物，使用其的模块装置以及组装模块的方法
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Application No.: US13336072Application Date: 2011-12-23
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Publication No.: US09086526B2Publication Date: 2015-07-21
- Inventor: Kyoung Jin Ha , Ji Hye Kwon , Kil Sung Lee , Irina Nam , Lee June Kim
- Applicant: Kyoung Jin Ha , Ji Hye Kwon , Kil Sung Lee , Irina Nam , Lee June Kim
- Applicant Address: KR Gumi-si, Kyeongsangbuk-do
- Assignee: CHEIL INDUSTRIES, INC.
- Current Assignee: CHEIL INDUSTRIES, INC.
- Current Assignee Address: KR Gumi-si, Kyeongsangbuk-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2010-0140044 20101231
- Main IPC: G02B1/04
- IPC: G02B1/04 ; C08G18/67 ; C08G18/72 ; C08G18/75 ; C08G18/79 ; C09J175/16
Abstract:
A photocurable adhesive composition, a module apparatus, and a method of assembling a module, the composition including a urethane (meth)acrylate binder, the composition having a viscosity of about 3,000 to about 6,000 cps at 25° C., and providing an adhesive film having an adhesive strength of about 30 N/cm2 or more.
Public/Granted literature
- US20120172481A1 PHOTOCURABLE ADHESIVE COMPOSITION, MODULE APPARATUS USING THE SAME, AND METHOD OF ASSEMBLING A MODULE Public/Granted day:2012-07-05
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