Invention Grant
- Patent Title: Three-dimensional structure for wiring formation
- Patent Title (中): 布线形成三维结构
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Application No.: US14196370Application Date: 2014-03-04
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Publication No.: US09082438B2Publication Date: 2015-07-14
- Inventor: Shingo Yoshioka , Hiroaki Fujiwara , Hiromitsu Takashita , Tsuyoshi Takeda
- Applicant: PANASONIC CORPORATION
- Applicant Address: JP Osaka
- Assignee: PANASONIC CORPORATION
- Current Assignee: PANASONIC CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2009-015052 20090127; JP2009-251269 20091030; JP2009-253131 20091104
- Main IPC: H01L23/48
- IPC: H01L23/48 ; G11B5/48 ; H01L23/00 ; H01L25/065 ; H01L25/00 ; H05K1/11 ; H05K1/18 ; H05K3/18 ; H01L21/66 ; H01L23/31 ; H01L21/56
Abstract:
One aspect of the present invention is a three-dimensional structure that has a concave-convex form including a gutter for wiring having at least partially a width of 20 μm or less, wherein at least a part of a wiring conductor is embedded in the gutter for wiring, and a wiring that extends in such a manner as to creep along the concave-convex form is provided.
Public/Granted literature
- US20140182887A1 THREE-DIMENSIONAL STRUCTURE FOR WIRING FORMATION Public/Granted day:2014-07-03
Information query
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