Invention Grant
US09041448B2 Flip-flops in a monolithic three-dimensional (3D) integrated circuit (IC) (3DIC) and related methods
有权
单片三维(3D)集成电路(IC)(3DIC)中的触发器和相关方法
- Patent Title: Flip-flops in a monolithic three-dimensional (3D) integrated circuit (IC) (3DIC) and related methods
- Patent Title (中): 单片三维(3D)集成电路(IC)(3DIC)中的触发器和相关方法
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Application No.: US13784915Application Date: 2013-03-05
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Publication No.: US09041448B2Publication Date: 2015-05-26
- Inventor: Yang Du , Jing Xie , Kambiz Samadi
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Withrow & Terranova, PLLC
- Main IPC: H03K3/289
- IPC: H03K3/289 ; H01L25/065 ; H01L25/00 ; H01L27/06 ; H03K3/037

Abstract:
Flip-flops in a monolithic three-dimensional (3D) integrated circuit (IC)(3DIC) and related method are disclosed. In one embodiment, a single clock source is provided for the 3DIC and distributed to elements within the 3DIC. Delay is provided to clock paths by selectively controllable flip-flops to help provide synchronous operation. In certain embodiments, 3D flip-flop are provided that include a master latch disposed in a first tier of a 3DIC. The master latch is configured to receive a flip-flop input and a clock input, the master latch configured to provide a master latch output. The 3D flip-flop also includes at least one slave latch disposed in at least one additional tier of the 3DIC, the at least one slave latch configured to provide a 3DIC flip-flop output. The 3D flip-flop also includes at least one monolithic intertier via (MIV) coupling the master latch output to an input of the slave latch.
Public/Granted literature
- US20140253196A1 FLIP-FLOPS IN A MONOLITHIC THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) AND RELATED METHODS Public/Granted day:2014-09-11
Information query
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