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发明授权
US09040213B2 Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and semiconductor device including the photosensitive resin film 有权
正型感光性树脂组合物，使用其制备的感光性树脂膜和包含感光性树脂膜的半导体装置

Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and semiconductor device including the photosensitive resin film
摘要：
Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin prepared by a phosphorous-containing diamine represented by the following Chemical Formula 1, (B) a photosensitive diazoquinone compound, and (C) a solvent. A photosensitive resin film prepared using the same and a semiconductor device including the photosensitive resin film are also disclosed. In Chemical Formula 1, each substituent is the same as defined in the detailed description.
摘要（中）：

公开了一种正型感光性树脂组合物，其包含（A）由以下化学式1表示的含磷二胺，（B）光敏性重氮醌化合物和（C）溶剂）制备的碱溶性树脂。 还公开了使用其制备的感光性树脂膜和包括感光性树脂膜的半导体装置。 在化学式1中，每个取代基与详细说明中所定义的相同。

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