发明授权
- 专利标题: Optical element package and manufacturing method thereof
- 专利标题(中): 光学元件封装及其制造方法
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申请号: US13598822申请日: 2012-08-30
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公开(公告)号: US09031367B2公开(公告)日: 2015-05-12
- 发明人: Kai-Wen Wu , Tai-Cherng Yu
- 申请人: Kai-Wen Wu , Tai-Cherng Yu
- 申请人地址: TW New Taipei
- 专利权人: Hon Hai Precision Industry Co., Ltd.
- 当前专利权人: Hon Hai Precision Industry Co., Ltd.
- 当前专利权人地址: TW New Taipei
- 代理机构: Novak Druce Connolly Bove + Quigg LLP
- 优先权: TW100144182A 20111201
- 主分类号: G02B6/12
- IPC分类号: G02B6/12 ; G02B6/30 ; G02B6/36 ; G02B6/42
摘要:
An optical element package includes an optical wave guide array, at least one optical assembly and at least one optical transmission member. The optical wave guide array has a reflection groove. The reflection groove includes a reflection surface. The at least one optical assembly is positioned on the optical wave guide array adjacent to the reflection surface. The at least one optical transmission member is positioned on the optical wave guide array, and is optically coupled with the reflection surface. The optical signals emitted by the at least one optical assembly are reflected by the reflection surface and then reaching the at least one optical transmission member for transmission.
公开/授权文献
- US20130142484A1 OPTICAL ELEMENT PACKAGE AND MANUFACTURING METHOD THEREOF 公开/授权日:2013-06-06
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