发明授权
US09030802B2 Multilayer ceramic electronic component, manufacturing method thereof, and board for mounting the same 有权
多层陶瓷电子部件及其制造方法以及用于安装的板

Multilayer ceramic electronic component, manufacturing method thereof, and board for mounting the same
摘要:
A multilayer ceramic electronic component includes a ceramic body including dielectric layers stacked in a thickness direction and satisfying T/W>1.0 when a width thereof is W and a thickness thereof is T; first and second internal electrodes; and first and second external electrodes, wherein when the ceramic body is divided into five regions in a width direction and a central region among the five regions is CW1 and regions adjacent to the central region CW1 are CW2 and CW3, a difference between electrode connectivity of the central region CW1 and electrode connectivity of the region CW2 or CW3 satisfies 0.02≦(CW2 or CW3)−CW1≦0.10.
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