发明授权
- 专利标题: Multilayer ceramic electronic component, manufacturing method thereof, and board for mounting the same
- 专利标题(中): 多层陶瓷电子部件及其制造方法以及用于安装的板
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申请号: US13924434申请日: 2013-06-21
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公开(公告)号: US09030802B2公开(公告)日: 2015-05-12
- 发明人: Min Gon Lee , Dae Bok Oh , Jong Han Kim , Seung Ho Lee
- 申请人: Samsung Electro-Mechanics Co., Ltd.
- 申请人地址: KR Suwon, Gyunggi-Do
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Suwon, Gyunggi-Do
- 代理机构: McDermott Will & Emery LLP
- 优先权: KR10-2013-0042860 20130418
- 主分类号: H01G4/06
- IPC分类号: H01G4/06 ; H01G4/30 ; H05K1/18
摘要:
A multilayer ceramic electronic component includes a ceramic body including dielectric layers stacked in a thickness direction and satisfying T/W>1.0 when a width thereof is W and a thickness thereof is T; first and second internal electrodes; and first and second external electrodes, wherein when the ceramic body is divided into five regions in a width direction and a central region among the five regions is CW1 and regions adjacent to the central region CW1 are CW2 and CW3, a difference between electrode connectivity of the central region CW1 and electrode connectivity of the region CW2 or CW3 satisfies 0.02≦(CW2 or CW3)−CW1≦0.10.
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