Provided are a printed circuit board (PCB) having hexagonally aligned bump pads as a substrate of a semiconductor package, and a semiconductor package including the same. The PCB includes: a PCB body; a bottom metal layer at a bottom of the PCB body; and a top metal layer at a top of the PCB body, and the top metal layer includes: vias vertically connected to the PCB body; bump pads hexagonally aligned in a horizontal direction around the vias; and connection patterns connecting the vias to two or more of the bump pads. Accordingly, the number of bump pads in a unit area of the PCB may be increased.