发明授权
- 专利标题： Integrated circuit package system with internal stacking module
- 专利标题（中）： 具有内部堆叠模块的集成电路封装系统
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申请号： US13563598申请日： 2012-07-31
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公开(公告)号： US09030006B2公开(公告)日： 2015-05-12
- 发明人: Seng Guan Chow , Heap Hoe Kuan , Reza Argenty Pagaila
- 申请人： Seng Guan Chow , Heap Hoe Kuan , Reza Argenty Pagaila
- 申请人地址： SG Singapore
- 专利权人： STATS ChipPAC Ltd.
- 当前专利权人： STATS ChipPAC Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 主分类号： H01L23/34
- IPC分类号： H01L23/34 ; H01L23/31 ; H01L21/56 ; H01L23/552 ; H01L25/03 ; H01L25/065 ; H01L25/10 ; H01L25/16 ; H01L23/498 ; H01L23/538 ; H01L23/00
摘要：
An integrated circuit package system includes: providing an integrated circuit substrate; forming an internal stacking module coupled to the integrated circuit substrate including: forming a flexible substrate, coupling a stacking module integrated circuit to the flexible substrate, and bending a flexible extension over the stacking module integrated circuit; and molding a package body on the integrated circuit substrate and the internal stacking module.
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