发明授权
- 专利标题： Stacked semiconductor apparatus, system and method of fabrication
- 专利标题（中）： 叠层半导体器件，系统和制造方法
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申请号： US13659146申请日： 2012-10-24
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公开(公告)号： US09030004B2公开(公告)日： 2015-05-12
- 发明人: Ki-Tae Park , Kang-Wook Lee , Young-Don Choi , Yun-Sang Lee
- 申请人： Ki-Tae Park , Kang-Wook Lee , Young-Don Choi , Yun-Sang Lee
- 申请人地址： KR Suwon-Si, Gyeonggi-Do
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Suwon-Si, Gyeonggi-Do
- 代理机构： Volentine & Whitt, PLLC
- 优先权： KR10-2008-0004351 20080115
- 主分类号： H01L23/538
- IPC分类号： H01L23/538 ; H01L23/34 ; H01L23/64 ; H01L25/065 ; G11C5/06
摘要：
A stacked semiconductor apparatus and method of fabricating same are disclosed. The apparatus includes upper and lower semiconductor devices having a similar pattern of connection elements. When stacked connected the resulting plurality of semiconductor devices includes a serial connection path traversing the stack, and may also include parallel connection paths, back-side mounted large components, and vertical thermal conduits.
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