发明授权
- 专利标题: Bonding structure of diaphragm for microspeaker
- 专利标题(中): 微波扬声器隔膜结合结构
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申请号: US14031385申请日: 2013-09-19
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公开(公告)号: US09027700B2公开(公告)日: 2015-05-12
- 发明人: Ji Hoon Kim , Joong Hak Kwon , Jung Hyung Lee , Hyeon Taek Oh
- 申请人: Em-Tech. Co., Ltd.
- 申请人地址: KR Busan
- 专利权人: Em-Tech. Co., Ltd.
- 当前专利权人: Em-Tech. Co., Ltd.
- 当前专利权人地址: KR Busan
- 代理机构: Murphy, Bilak & Homiller, PLLC
- 优先权: KR10-2013-0046102 20130425
- 主分类号: H04R7/02
- IPC分类号: H04R7/02 ; H04R7/14 ; H04R9/04 ; H04R31/00
摘要:
The present invention relates to an assembly structure of a diaphragm for a microspeaker. The present invention discloses a bonding structure of a diaphragm for a microspeaker, the boding structure comprising: a suspension including a central portion, an outer peripheral portion, and a connecting portion connecting the central portion and the outer peripheral portion; and a side diaphragm including an inner peripheral portion and an outer peripheral portion, which are attached to the central portion and outer peripheral portion of the suspension, respectively, and a dome portion, which projects between the inner peripheral portion and the outer peripheral portion, wherein the suspension and the side diaphragm are attached by thermal compression.
公开/授权文献
- US20140318885A1 BONDING STRUCTURE OF DIAPHRAGM FOR MICROSPEAKER 公开/授权日:2014-10-30
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