发明授权
- 专利标题: Sensor over-mold shape
- 专利标题(中): 传感器过模具形状
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申请号: US13362305申请日: 2012-01-31
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公开(公告)号: US09005134B2公开(公告)日: 2015-04-14
- 发明人: Daniel S. Flo , James K. Carney , Kamal Deep Mothilal , Jon D. Schell
- 申请人: Daniel S. Flo , James K. Carney , Kamal Deep Mothilal , Jon D. Schell
- 申请人地址: US MN Minneapolis
- 专利权人: Medtronic, Inc.
- 当前专利权人: Medtronic, Inc.
- 当前专利权人地址: US MN Minneapolis
- 代理商 Evans M. Mburu
- 主分类号: A61B5/00
- IPC分类号: A61B5/00 ; A61B5/0215 ; A61B5/03 ; G01L9/00 ; G01L19/00
摘要:
An implantable medical device having a flexible diaphragm is provided with a housing including a shell and an outer layer. The flexible diaphragm extends along the shell. The outer layer has an outer surface and an inner surface. An adhesive coating is applied between the diaphragm and the inner surface of the outer layer. The outer layer includes a recess along the diaphragm for receiving the adhesive.
公开/授权文献
- US20130197396A1 SENSOR OVER-MOLD SHAPE 公开/授权日:2013-08-01
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