Invention Grant
- Patent Title: Mechanisms for forming micro-electro mechanical system device
- Patent Title (中): 微机电系统装置的形成机理
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Application No.: US13946566Application Date: 2013-07-19
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Publication No.: US08994129B2Publication Date: 2015-03-31
- Inventor: Chun-Ren Cheng
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: B81B7/00
- IPC: B81B7/00 ; B81C1/00
Abstract:
Embodiments of mechanisms for forming a micro-electro mechanical system (MEMS) device are provided. The MEMS device includes a substrate and a MEMS structure over the substrate, and the MEMS structure has a movable element. The movable element is surrounded by a cavity. The MEMS device also includes a fuse layer on the movable element, and the fuse layer has a wide portion and a narrow portion linked to the wide portion.
Public/Granted literature
- US20150021723A1 MECHANISMS FOR FORMING MICRO-ELECTRO MECHANICAL SYSTEM DEVICE Public/Granted day:2015-01-22
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