发明授权
- 专利标题: Integrated electronic structure
- 专利标题(中): 集成电子结构
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申请号: US13846130申请日: 2013-03-18
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公开(公告)号: US08988172B1公开(公告)日: 2015-03-24
- 发明人: Marc T. Angelucci
- 申请人: Lockheed Martin Corporation
- 申请人地址: US MD Bethesda
- 专利权人: Lockheed Martin Corporation
- 当前专利权人: Lockheed Martin Corporation
- 当前专利权人地址: US MD Bethesda
- 代理机构: Howard IP Law Group, PC
- 主分类号: H01P3/08
- IPC分类号: H01P3/08 ; H01Q1/20 ; H01Q1/48 ; H01Q1/12
摘要:
A multifunction electronics member combining structural and electronics functions includes in one embodiment an elongate longitudinally-extending structural body configured to support a structural load and including a first support base, a stiffening projection, and a first electrical circuit supported by the first support base. The circuit preferably is embedded between the first circuit base and a cover to form an electrically-active, or in some embodiments passive, structural member.
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