发明授权
- 专利标题: Light emitting device package
- 专利标题(中): 发光装置封装
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申请号: US14078369申请日: 2013-11-12
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公开(公告)号: US08987775B2公开(公告)日: 2015-03-24
- 发明人: Ki Bum Kim
- 申请人: Ki Bum Kim
- 申请人地址: KR Seoul
- 专利权人: LG Innotek Co., Ltd.
- 当前专利权人: LG Innotek Co., Ltd.
- 当前专利权人地址: KR Seoul
- 代理机构: KED & Associates LLP
- 优先权: KR10-2009-0020064 20090310; KR10-2010-0020041 20100305; KR10-2010-0020043 20100305
- 主分类号: H01L33/62
- IPC分类号: H01L33/62 ; H01L33/48
摘要:
Embodiments include a light emitting device package. The light emitting device package comprises a housing including a cavity; a light emitting device positioned in the cavity; a lead frame including a first section electrically connected to the light emitting device in the cavity, a second section, which penetrates the housing, extending from the first section and a third section, which is exposed to outside air, extending from the second section; and a metal layer positioned on an area defined by a distance which is distant from the housing in the second section of the lead frame.
公开/授权文献
- US20140084330A1 LIGHT EMITTING DEVICE PACKAGE 公开/授权日:2014-03-27
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