发明授权
US08987775B2 Light emitting device package 有权
发光装置封装

  • 专利标题: Light emitting device package
  • 专利标题(中): 发光装置封装
  • 申请号: US14078369
    申请日: 2013-11-12
  • 公开(公告)号: US08987775B2
    公开(公告)日: 2015-03-24
  • 发明人: Ki Bum Kim
  • 申请人: Ki Bum Kim
  • 申请人地址: KR Seoul
  • 专利权人: LG Innotek Co., Ltd.
  • 当前专利权人: LG Innotek Co., Ltd.
  • 当前专利权人地址: KR Seoul
  • 代理机构: KED & Associates LLP
  • 优先权: KR10-2009-0020064 20090310; KR10-2010-0020041 20100305; KR10-2010-0020043 20100305
  • 主分类号: H01L33/62
  • IPC分类号: H01L33/62 H01L33/48
Light emitting device package
摘要:
Embodiments include a light emitting device package. The light emitting device package comprises a housing including a cavity; a light emitting device positioned in the cavity; a lead frame including a first section electrically connected to the light emitting device in the cavity, a second section, which penetrates the housing, extending from the first section and a third section, which is exposed to outside air, extending from the second section; and a metal layer positioned on an area defined by a distance which is distant from the housing in the second section of the lead frame.
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