Invention Grant
- Patent Title: Bumper made using a resistive implant welding process
- Patent Title (中): 保险杠采用电阻式植入式焊接工艺制成
-
Application No.: US13983919Application Date: 2012-02-10
-
Publication No.: US08985650B2Publication Date: 2015-03-24
- Inventor: Mark P. Birka
- Applicant: Mark P. Birka
- Applicant Address: CA
- Assignee: Magna International Inc.
- Current Assignee: Magna International Inc.
- Current Assignee Address: CA
- Agency: Warn Partners, P.C.
- International Application: PCT/US2012/024650 WO 20120210
- International Announcement: WO2012/109541 WO 20120816
- Main IPC: B60R19/03
- IPC: B60R19/03 ; B29C65/34 ; B29C65/00 ; B29L31/30 ; B29C65/48 ; B29C65/58

Abstract:
A bumper (10) created using a resistive implant welding process. The bumper includes a mounting plate portion (12) and a composite bumper portion (14). The mounting plate portion (12) is connected to the composite bumper portion (14) using a resistive implant welding process. In one embodiment, the present invention includes a bumper for a vehicle having a mounting plate (12) and a bumper portion (14). The bumper portion (14) includes at least one flange (24) formed as part of the bumper portion (14), a first contact area (28) formed as part of the mounting plate (12), and a second contact area (30) formed as part of the flange (24). A connection point is used to bond the first contact area (28) and the second contact area (30) such that the mounting plate (12) is connected to the bumper portion (14).
Public/Granted literature
- US20130307281A1 BUMPER MADE USING A RESISTIVE IMPLANT WELDING PROCESS Public/Granted day:2013-11-21
Information query