Invention Grant
- Patent Title: Data transfer across power domains
- Patent Title (中): 电力领域的数据传输
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Application No.: US13792592Application Date: 2013-03-11
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Publication No.: US08984463B2Publication Date: 2015-03-17
- Inventor: Jing Xie , Yang Du
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Nicholas J. Pauley; Peter Michael Kamarchik; Joseph Agusta
- Main IPC: G06F17/50
- IPC: G06F17/50 ; H01L23/522 ; G11C5/14 ; G06F1/32

Abstract:
The disclosed embodiments comprise a multi-stage circuit operating across different power domains. The multi-stage circuit may be implemented as a master-slave flip-flop circuit integrated with a level shifter that transfers data across different power domains. The master and slave stages of the flip-flop may be split across two tiers of a 3D IC and may include (i) a level shifter across different power domain integrated within the flip-flop circuit, (ii) reduced one-state writing delays by a self-induced power collapsing technique, (iii) splitting flip-flop power supplies in different tiers using monolithic 3D IC technology, and (iv) cross power domain data transfer between 3D IC tiers.
Public/Granted literature
- US20140146630A1 DATA TRANSFER ACROSS POWER DOMAINS Public/Granted day:2014-05-29
Information query