发明授权
US08982362B2 System and method for measuring layer thickness and depositing semiconductor layers
有权
用于测量层厚度和沉积半导体层的系统和方法
- 专利标题： System and method for measuring layer thickness and depositing semiconductor layers
- 专利标题（中）： 用于测量层厚度和沉积半导体层的系统和方法
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申请号： US13645000申请日： 2012-10-04
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公开(公告)号： US08982362B2公开(公告)日： 2015-03-17
- 发明人: Erel Milshtein
- 申请人： First Solar, Inc.
- 申请人地址： US OH Perrysburg
- 专利权人： First Solar, Inc.
- 当前专利权人： First Solar, Inc.
- 当前专利权人地址： US OH Perrysburg
- 代理机构： Dickstein Shapiro LLP
- 主分类号： G01B11/28
- IPC分类号： G01B11/28 ; G01N21/86 ; G01V8/00 ; G01B11/06 ; H01L21/02 ; H01L21/66 ; C23C16/455 ; C23C16/52 ; H01L31/073 ; H01L31/0749 ; H01L31/18
摘要：
Described herein is a method and apparatus for measuring the thickness of a deposited semiconductor material. A colorimeter has an optical source that illuminates a portion of a deposited semiconductor material with optical radiation, a sensor that collects and measures color information related to reflected radiation from the deposited semiconductor material, and a processor that receives the color information related to the reflected radiation from the sensor and calculates a thickness of the semiconductor material. The processor may control a semiconductor material deposition apparatus.
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