发明授权
US08964772B2 Method for implementing a multi-chip module with a high-rate interface
有权
用于实现具有高速率接口的多芯片模块的方法
- 专利标题: Method for implementing a multi-chip module with a high-rate interface
- 专利标题(中): 用于实现具有高速率接口的多芯片模块的方法
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申请号: US13648227申请日: 2012-10-09
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公开(公告)号: US08964772B2公开(公告)日: 2015-02-24
- 发明人: William Calvin Woodruff
- 申请人: Broadcom Corporation
- 申请人地址: US CA Irvine
- 专利权人: Broadcom Corporation
- 当前专利权人: Broadcom Corporation
- 当前专利权人地址: US CA Irvine
- 代理机构: McDermott Will & Emery LLP
- 主分类号: H04L12/28
- IPC分类号: H04L12/28
摘要:
A multi-chip module (MCM) may include a substrate, and first and second physical-layer (PHY) chips mounted on the substrate. In some implementations, the first PHY chip includes a multiplexer and a PHY circuit. The multiplexer is configured to receive a multiplexed data stream from a media access control (MAC) device, to demultiplex the multiplexed data stream into first and second data streams, to output the first data stream to the PHY circuit, and to output the second data stream to the second PHY chip. In some implementations, the first PHY includes a router and a PHY circuit. The router is configured to receive a plurality of data packets from a MAC device, to route one or more of the data packets having a first address to the PHY circuit, and to route one or more of the data packets having a second address to the second PHY chip.
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