发明授权
- 专利标题： Light-emitting device and lighting apparatus
- 专利标题（中）： 发光装置及照明装置
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申请号： US13392107申请日： 2010-08-25
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公开(公告)号： US08963190B2公开(公告)日： 2015-02-24
- 发明人: Ryotaro Matsuda , Kozo Ogawa , Makoto Sakai , Akiko Takahashi , Keiichi Shimizu , Kiyoshi Nishimura
- 申请人： Ryotaro Matsuda , Kozo Ogawa , Makoto Sakai , Akiko Takahashi , Keiichi Shimizu , Kiyoshi Nishimura
- 申请人地址： JP Kanagawa JP Tokyo
- 专利权人： Toshiba Lighting & Technology Corporation,Kabushiki Kaisha Toshiba
- 当前专利权人： Toshiba Lighting & Technology Corporation,Kabushiki Kaisha Toshiba
- 当前专利权人地址： JP Kanagawa JP Tokyo
- 代理机构： DLA Piper LLP (US)
- 优先权： JP2009-194853 20090825; JP2009-244987 20091023
- 国际申请： PCT/JP2010/064396 WO 20100825
- 国际公布： WO2011/024861 WO 20110303
- 主分类号： H01L33/64
- IPC分类号： H01L33/64 ; F21V3/04 ; F21S8/04 ; F21V29/00 ; F21Y101/02 ; F21Y105/00
摘要：
A light-emitting device includes a substrate having a front surface on which a semiconductor light-emitting element is mounted. A front cover is provided which thermally contacts the front surface of the substrate at a periphery of the semiconductor light-emitting element and is disposed on a front side of the substrate. A heat conduction path is formed along which heat generated by the semiconductor light-emitting element is conducted in order of the substrate and the front cover and the heat is radiated from a front surface of the front cover, so that a heat radiation property from a front surface of the light-emitting device is improved.
公开/授权文献
- US20120161194A1 LIGHT-EMITTING DEVICE AND LIGHTING APPARATUS 公开/授权日：2012-06-28
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