发明授权
- 专利标题： Flux for soldering and soldering process
- 专利标题（中）： 用于焊接和焊接工艺的焊剂
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申请号： US10586598申请日： 2005-01-27
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公开(公告)号： US08960526B2公开(公告)日： 2015-02-24
- 发明人: Tadashi Maeda , Tadahiko Sakai
- 申请人： Tadashi Maeda , Tadahiko Sakai
- 申请人地址： JP Osaka
- 专利权人： Panasonic Intellectual Property Management Co., Ltd.
- 当前专利权人： Panasonic Intellectual Property Management Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： JP2004-021090 20040129; JP2004-327440 20041111
- 国际申请： PCT/JP2005/001087 WO 20050127
- 国际公布： WO2005/072906 WO 20050811
- 主分类号： B23K1/20
- IPC分类号： B23K1/20 ; B23K35/02 ; B23K35/30 ; B23K35/36 ; H01L21/683 ; H01L23/00 ; H05K3/34
摘要：
There is provided a flux for soldering and a soldering process which form better solder connection without the occurrence of the poor connection nor the insulation degradation.Such flux which is placed between a solder portion formed on a first electrode and a second electrode when the first electrode is soldered to the second electrode contains: a liquid base material made of a resin component which is dissolved in a solvent, an active component which removes an oxide film, and a metal powder made of a metal of which melting point is higher than that of a solder material which forms the solder portion, and the flux contains the metal powder in an amount in the range between 1% and 9% by volume based on a volume of the flux.
公开/授权文献
- US20080244900A1 Flux for Soldering and Soldering Process 公开/授权日：2008-10-09
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