Invention Grant
- Patent Title: Process of repairing a component, a repair tool for a component, and a component
- Patent Title (中): 维修零件的过程,零件修理工具和零件
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Application No.: US13426031Application Date: 2012-03-21
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Publication No.: US08959738B2Publication Date: 2015-02-24
- Inventor: Yagnesh Dalpatbhai Hathiwala , Howard Gerhard Halverson , Somayajula Kumar , Sabarinath Devarajan , David Christopher Bayer
- Applicant: Yagnesh Dalpatbhai Hathiwala , Howard Gerhard Halverson , Somayajula Kumar , Sabarinath Devarajan , David Christopher Bayer
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: McNees Wallace & Nurick LLC
- Main IPC: B64C11/04
- IPC: B64C11/04 ; B23P6/00 ; B23P19/04 ; F04D29/34

Abstract:
A process of repairing a component, a repair tool for a component, and a component are disclosed. The process includes removing material from a region of the component. The removing forms a through-cut in the component, forms a partial-frustoconical geometry in the component, forms a substantially partial-frustoconical geometry in the component, forms a partial-spherical geometry in the component, forms a substantially partial-spherical geometry in the component, forms a partial-elliptical geometry in the component, forms a substantially partial-elliptical geometry in the component, forms a partial-cylindrical geometry in the component, forms a substantially partial-cylindrical geometry in the component, is in a direction substantially perpendicular to a surface of the component, is in a direction substantially inclined with respect to the surface of the component, or a combination thereof. The repair tool includes a securing mechanism and a cutting portion for removing a region. The component includes a region formed by removing material.
Public/Granted literature
- US20130247377A1 PROCESS OF REPAIRING A COMPONENT, A REPAIR TOOL FOR A COMPONENT, AND A COMPONENT Public/Granted day:2013-09-26
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