Invention Grant
- Patent Title: Electrical connector with low profile
- Patent Title (中): 薄型电连接器
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Application No.: US13757736Application Date: 2013-02-02
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Publication No.: US08944854B2Publication Date: 2015-02-03
- Inventor: Albert Harvey Terhune, IV
- Applicant: Albert Harvey Terhune, IV
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agent Wei Te Chung; Ming Chieh Chang
- Main IPC: H01R24/00
- IPC: H01R24/00 ; H05K7/10

Abstract:
An electrical connector for use with an electronic package, includes a base plate and a top housing. The base plate has a number of contacts with mating portions extending upward beyond a top surface of base plate. The top housing has a plurality of through holes corresponding to the contacts and receives the mating portions. The top housing defines a pair of channels to allow the electronic package moving relative to the top housing in a horizontal direction, and then the top housing with the electronic package move relative to the base plate in a vertical direction such that the mating portions protrude from a top surface of the top housing and contact with the electronic package.
Public/Granted literature
- US20140220829A1 ELECTRICAL CONNECTOR WITH LOW PROFILE Public/Granted day:2014-08-07
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