Invention Grant
- Patent Title: Induction bonding
- Patent Title (中): 感应焊接
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Application No.: US14200745Application Date: 2014-03-07
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Publication No.: US08931684B2Publication Date: 2015-01-13
- Inventor: Michael Nikkhoo , Amir Salehi
- Applicant: Apple Inc.
- Agency: Womble Carlyle Sandridge & Rice, LLP
- Main IPC: B23K31/02
- IPC: B23K31/02 ; B23K1/002 ; H01R43/02 ; H05K13/00 ; B23K3/00 ; H05K3/34 ; H01R12/53
Abstract:
The described embodiment relates generally to the field of inductive bonding. More specifically an inductive heater designed for use in assembling electronics is disclosed. A number of methods for shaping a magnetic field are disclosed for the purpose of completing an inductive bonding process without causing harm to unshielded adjacent electrical components.
Public/Granted literature
- US20140182128A1 INDUCTION BONDING Public/Granted day:2014-07-03
Information query
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