Invention Grant
- Patent Title: Semiconductor module
- Patent Title (中): 半导体模块
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Application No.: US14236236Application Date: 2012-08-24
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Publication No.: US08921998B2Publication Date: 2014-12-30
- Inventor: Yusuke Zushi , Yoshinori Murakami , Satoshi Tanimoto , Shinji Sato , Kohei Matsui
- Applicant: Yusuke Zushi , Yoshinori Murakami , Satoshi Tanimoto , Shinji Sato , Kohei Matsui
- Applicant Address: JP Yokohama JP Niiza JP Kawasaki
- Assignee: Nissan Motor Co., Ltd.,Sanken Electric Co., Ltd.,Fuji Electric Co., Ltd.
- Current Assignee: Nissan Motor Co., Ltd.,Sanken Electric Co., Ltd.,Fuji Electric Co., Ltd.
- Current Assignee Address: JP Yokohama JP Niiza JP Kawasaki
- Agency: Global IP Counselors, LLP
- Priority: JP2011-184019 20110825
- International Application: PCT/JP2012/071398 WO 20120824
- International Announcement: WO2013/027819 WO 20130228
- Main IPC: H01L23/10
- IPC: H01L23/10 ; H01L23/34 ; H01L23/538 ; H01L23/373 ; H01L23/00 ; H01L25/07 ; H01L23/498 ; H01L25/18

Abstract:
A semiconductor module has a pair of semiconductor devices, a heat sink, a first electrode, an output electrode and a second electrode. The semiconductor devices are connected in series with each other and have first terminals that are electrically connected to a first power system and a second terminal that is electrically connected to a second power system. The first electrode is electrically connected both to one of the first terminal and to an electrode of one of the semiconductor devices. The output electrode is electrically connected both to the second terminal and to an electrode of the other of the semiconductor device. The second electrode is electrically connected to the other of the first terminals. The second electrode is connected to the heat sink via a first insulating member. The output electrode is connected to the second electrode via a second insulating member.
Public/Granted literature
- US20140159225A1 SEMICONDUCTOR MODULE Public/Granted day:2014-06-12
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