Invention Grant
- Patent Title: Silicone resin
- Patent Title (中): 硅树脂
-
Application No.: US13555574Application Date: 2012-07-23
-
Publication No.: US08916671B2Publication Date: 2014-12-23
- Inventor: Min Jin Ko , Myung Sun Moon , Jae Ho Jung , Bum Gyu Choi , Dae Ho Kang , Min Kyoun Kim
- Applicant: Min Jin Ko , Myung Sun Moon , Jae Ho Jung , Bum Gyu Choi , Dae Ho Kang , Min Kyoun Kim
- Applicant Address: KR Seoul
- Assignee: LG Chem, Ltd.
- Current Assignee: LG Chem, Ltd.
- Current Assignee Address: KR Seoul
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: KR10-2010-0006701 20100125; KR10-2011-0007456 20110125
- Main IPC: H01L23/29
- IPC: H01L23/29 ; C08G77/04 ; C08G77/20 ; H01L33/56 ; C08L83/04 ; C08G77/12 ; C08K5/56 ; C08G77/00
Abstract:
A silicone resin is provided. The silicone resin may be effectively used to encapsulate a semiconductor element, for example, a light-emitting element of a light-emitting diode.
Public/Granted literature
- US20130187176A1 SILICONE RESIN Public/Granted day:2013-07-25
Information query
IPC分类:
