Invention Grant
- Patent Title: Treating copper surfaces for packaging
- Patent Title (中): 处理铜表面进行包装
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Application No.: US13794698Application Date: 2013-03-11
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Publication No.: US08907479B2Publication Date: 2014-12-09
- Inventor: Chih-Horng Chang , Tin-Hao Kuo
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/485
- IPC: H01L23/485 ; H01L21/56 ; H01L23/498
Abstract:
A die has a top surface, and a metal pillar having a portion protruding over the top surface of the die. A sidewall of the metal pillar has nano-wires. The die is bonded to a package substrate. An underfill is filled into the gap between the die and the package substrate.
Public/Granted literature
- US20140252600A1 Treating Copper Surfaces for Packaging Public/Granted day:2014-09-11
Information query
IPC分类:
