Invention Grant
- Patent Title: Electronic devices with yielding substrates
- Patent Title (中): 具有屈服底物的电子设备
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Application No.: US14169384Application Date: 2014-01-31
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Publication No.: US08907370B2Publication Date: 2014-12-09
- Inventor: Michael A. Tischler , Philippe M. Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
- Applicant: Michael A. Tischler , Philippe M. Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
- Applicant Address: CA Burnaby
- Assignee: Cooledge Lighting Inc.
- Current Assignee: Cooledge Lighting Inc.
- Current Assignee Address: CA Burnaby
- Agency: Bingham McCutchen LLP
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L21/00
Abstract:
In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
Public/Granted literature
- US20140191257A1 ELECTRONIC DEVICES WITH YIELDING SUBSTRATES Public/Granted day:2014-07-10
Information query
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